JEDEC

4 results - showing 1 - 4
Printed circuit board assemblies experience various mechanical loading conditions during assembly and use. The repeated flexing and cyclic bending ...
Standard
  • jedec jesd 22b113
This test provides a means for determining the strength of a gold ball bond to a die bonding surface or an aluminum wedge or stitch bond to a die o...
Standard
  • jedec jesd 22b116a
The purpose of this test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device ...
Standard
  • jedec jesd 22b117a
The Flip Chip Tensile Pull Test Method is performed to determine the fracture mode and strength of the solder bump interconnection between the flip...
Standard
  • jedec jesd 22b109a
4 results - showing 1 - 4

Need Help?

Talk to one of our Application Engineers to help you find the right solution for your test applications

Contact Us Now