JEDEC

4 results - showing 1 - 4

Printed circuit board assemblies experience various mechanical loading conditions ...

Standard

This test provides a means for determining the strength of a gold ball bond to a d...

Standard

The purpose of this test is conducted to assess the ability of solder balls to wit...

Standard

The Flip Chip Tensile Pull Test Method is performed to determine the fracture mode...

Standard

4 results - showing 1 - 4

Talk to one of our Application Engineers to help you find the right solution for your test applications

CALL NOW

An application expert will also help you with:

If you know exactly what you want:

If you're new to testing or don’t know what you need:

If you need something you don’t see on our website?

Help you locate the product you need or scope the degree of customization required: tweak an existing design to start from scratch new design
Provide price and delivery estimates