JEDEC

4 results - showing 1 - 4
Printed circuit board assemblies experience various mechanical loading conditions ...
Standard
  • jedec jesd 22b113
This test provides a means for determining the strength of a gold ball bond to a d...
Standard
  • jedec jesd 22b116a
The purpose of this test is conducted to assess the ability of solder balls to wit...
Standard
  • jedec jesd 22b117a
The Flip Chip Tensile Pull Test Method is performed to determine the fracture mode...
Standard
  • jedec jesd 22b109a
4 results - showing 1 - 4

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