IPC JEDEC 9702 Monotonic Bend Testing Interconnects - Board Level

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IPC JEDEC 9702 Monotonic Bend Testing Interconnects - Board Level

JEDEC 9702 monotonic bend testing method is intended to characterize the fracture strength of a components board-level interconnects. It is applicable to surface mount components attached to printed wiring boards using conventional solder reflow technologies. The monotonic bend characterization results provide a measure of fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations, and supplements existing standards that address mechanical shock or impact during shipping, handling or field operation.

Equipment required

The crosshead travel distance and crosshead speed needs to be configured to be approximately proportional to the test board assembly strain and strain-rate, respectively. The relationship between these variables can be determined empirically by testing a mechanically representative package/board assembly (set-up test board); however, these relationships may prove non-constant or non determinant, depending on the configuration and board/ package configuration.

This test method specifies use of the simplified analytical relationships to establish the test machine control settings for crosshead travel distance and crosshead speed, based upon global PWB strain and strain-rate input variables, respectively. These equations are derived from classic beam theory and ignore any effects due to the package(s), or to the Poissons ratio effect of a plate in bending.

Note from 8.12 - Four-Point Bend Test should be oriented such that the component leads or solder joints are placed in tension during the four point bend test. Empirical testing indicates that board-level package solder connections are typically more susceptible to fracture with increased strain-rate (at comparable PWB strain levels). Testing conducted at crosshead speeds less than specified will tend to overstate fracture strength of a components board-level interconnects; hence, test equipment and test board configurations should be selected that meet the minimum crosshead speed shown below, wherever possible, to insure consistent, conservative reporting of interconnect strength.

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