Printed Circuit Board Pin Pull Test

0 1
Printed Circuit Board Pin Pull Test

The pin pull test is performed on printed circuit boards by subjecting a solder pin to a tensile force until failure occurs. This measures the adhesion strength of the solder pin to the pad and the pad to the laminate. The miniature size pins are closely arranged in an array and the fixtures selected must ensure that the pins are not damaged prior to or during clamping.