Testing the mechanical endurance and integrity of electronics components and assemblies is important to validate designs, improve manufacturing, and ensure the reliability of final products.
A variety of tests are involved, covering adhesives, connections, interconnections, and package testing. Tests include adhesive peel, micro-bend, indentation and die shear, with component testing such as contact spring durability, cyclic and fatigue testing on mobile phone parts.
Circuit devices and boards experience thermal as well as mechanical strain and fatigue life challenges. Fatigue tests can be used to mimic thermal stress, to shorten life tests. Ball grid array tests confirm device performance and torsion tests are used to test assemblies and fasteners. High speed impact or disconnect tests are used in applications involving connector separation on impact.
Popular Testing Applications
Printed circuit board assemblies experience various mechanical loading conditions ...
IPC TM 650 Section 2.4 offers a list of mechanical tests that include adhesion, fa...
JEDEC 9702 monotonic bend testing method is intended to characterize the fracture ...
This test provides a means for determining the strength of a gold ball bond to a d...
The pin pull test is performed on printed circuit boards by subjecting a solder pi...
The purpose of this test is conducted to assess the ability of solder balls to wit...
The Flip Chip Tensile Pull Test Method is performed to determine the fracture mode...
ASTM F2592 covers the measurement of force displacement characteristics of a membr...
Increasing demand for high quality and reliable electronic components and material...
Electronics tests place a wide range of performance demands on test equipment for ...
Microprocessors are being added to products more and more every day. Mobile electr...
Compression testing applications in the electronic industry include actuation forc...
Increasing demand for high quality and reliable electronic components and material...
Compression tests determine how a product reacts when it is compressed, squashed, ...
